Memory Organization of Embedded System MCQ Quiz – Objective Question with Answer for Memory Organization of Embedded System

21. Which of the following provides stability to the multitasking system?

A. memory
B. DRAM
C. SRAM
D. Memory partitioning

Answer: D

The memory partitioning provides stability to the multitasking system so that the errors within one task will not corrupt the other tasks.

 

22. Which of the following is used by the M68000 family?

A. M68000
B. 80386
C. 8086
D. 80286

Answer: A

The M68000 uses memory partitioning by the use of function code or by the combination of superscalar signals and the Harvard architecture.

 

23. What can be done for the fine-grain protection of the processor?

A. add an extra description bit
B. add error signal
C. add wait stage
D. remains unchanged

Answer: A

The finer grain protection of memory management is achieved by the addition of an extra description bit to an address to declare its status. The memory management unit can detect an error if the task attempts to access memory that has not been allocated to it or a certain kind of mismatch occurs.

 

24. Which of the following technique is used by the UNIX operating system?

A. logical address memory
B. physical address memory
C. virtual memory technique
D. translational address

Answer: C

In the workstation and the UNIX operating system, the virtual memory technique is frequently used in which the main memory is divided into different segments and pages. These pages will have a virtual address which can increase the address spacing.

 

25. Which of the following consist of two lines of legs on both sides of a plastic or ceramic body?

A. SIMM
B. DIMM
C. Zig-zag
D. Dual-in-line

Answer: D

The dual-in-line package consists of two lines of legs on both sides of the plastic or ceramic. Most commonly used are BIOS EPROMs, DRAM, and SRAM.

 

26. Which package has high memory speed and changes in the supply?

A. DIP
B. SIMM
C. DIMM
D. zig-zag

Answer: C

DIMM is a special version of SIMM which is a 168-bits wider bus and looks similar to a larger SIMM. The wider bus increases the memory speed and change in supply voltage.

 

27. Which is a subassembly package?

A. dual-in-line
B. zig-zag
C. simm
D. ceramic shell

Answer: C

The SIMM is basically a subassembly, not a package. It is a small board that possesses a finger connection on the bottom and sufficient memory on the board in order to make up the required configuration.

 

28. What is the required voltage of DIMM?

A. 2V
B. 2.2V
C. 5V
D. 3.3V

Answer: D

For increasing the speed and reducing the power consumption, it is necessary to reduce the power supply. Today’s CPUs and memories have a 3.3V supply or even lower instead of the signal level from 0 to 5V. DIMMs are described by their voltage, speed, and memory type respectively as 3.3V 133MHz SDRAM DIMM.

 

29. Which memory package has a single row of pins?

A. SIMM
B. DIP
C. SIP
D. zig-zag

Answer: C

The Single-in-line package is the same as that of SIMM, in which the finger connections are replaced by a single row of pins. SIP took the popularity of SIMM but nowadays it is rarely seen.

 

30. What is the access time of MCM51000AP10?

A. 100ns
B. 80ns
C. 60ns
D. 40ns

Answer: A

The access time of the memory is defined as the maximum time taken by the chip to read/write data and it is very important to match the access time to the design. For example, MCM51000AP10 has a 100ns access time for the memory.

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