MOS and BiCMOS Circuit Design Processes MCQ Quiz – Objective Question with Answer for MOS and BiCMOS Circuit Design Processes MCQ

12. Stick diagram gives the position of placement of the element.

A. true
B. false

Answer: B

The Stick diagram does not show the exact placement of components, transistor length, wire length and width, tub boundaries, etc.

 

13. When two or more cuts of the same type cross or touch each other, that represents ____________

A. contact cut
B. electrical contact
C. like contact
D. cross-contact

Answer: B

When two or more sticks of the same type cross or touch each other, then that forms a contact called electrical contact.

 

14. Circuit design concepts can also be represented using a symbolic diagram.

A. true

B. false

Answer: A

Circuit design concepts can be represented using stick diagrams and symbolic diagrams. Stick diagrams represent different layers with color codes. The symbolic diagram represents the structure with symbols with color codes.

 

15. Circuit designers need _______ circuits.

A. tighter
B. smaller layout
C. decreased silicon area
D. all of the mentioned

Answer: D

Circuit designers in general prefer tighter, smaller layouts for improved performance and decreased silicon area.

 

16. Process engineers want ______ process.

A. smaller
B. tighter
C. reproducible
D. non-reproducible

Answer: C

Process engineers want design rules which are controllable and reproducible process.

 

17. Maturity level of the process line affects design rules.

A. true

B. false

Answer: A

The maturity level of the process line affects design rules.

Some of the advantages of generalized design rules are durable, scalable, portable, increased designer efficiency, and automatic translation to the final layout can be done.

 

18. Design rules does not specify __________

A. linewidths
B. separations
C. extensions
D. colors

Answer: D

Design rules specify line widths, separations and extensions in terms of lambda.

Some of the advantages of generalized design rules are durable, scalable, portable, increased designer efficiency, and automatic translation to the final layout can be done.

 

19. The width of the n-diffusion and p-diffusion layer should be?

A. 3λ
B. 2λ
C. λ
D. 4λ

Answer: B

The width of n-diffusion and p-diffusion should be 2λ according to design rules.

 

20. What should be the spacing between two diffusion layers?

A. 4λ
B. λ
C. 3λ
D. 2λ

Answer: C

The spacing between two diffusion layers should be 3λ according to design rules and standards.

 

21. What should be the width of metal 1 and metal 2 layers?
A. 3λ, 3λ
B. 2λ, 3λ
C. 3λ, 4λ
D. 4λ, 3λ

Answer: C

The width of the metal 1 layer should be 3λ and metal 2 should be 4λ.

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