Miniaturization of components with superior performance can be obtained in Integrated circuits.

All the components in integrated circuits are fabricated on the same chip, whereas in discrete circuits discrete components are used and occupy more area.

Integrated Circuits are considered to be economical because it reduces the cost due to batch production. A standard 10cm diameter wafer can be divided into 8000 rectangular chips (approx). So, if 10 wafers are processed in one batch, then 80,000 ICs are produced simultaneously.

Multipliers circuit is not made of digital ICs.  They are made up of Linear Integrated Circuits.

Digital circuits are primarily concerned with only two levels of voltages (or currents): ‘high’ and ‘low’. Therefore, accurate control of operating region characteristics is not required in digital circuits, unlike in linear circuits.

The output electrical signal and the input signal applied in a linear circuit vary either in proportion or in the physical quantities they represent. Since the electrical signals are analogous to the physical quantities, linear circuits are also referred to as analog circuits.

The majority of linear ICs are available as an operational amplifier. So, these components array consists of a group of isolated transistors, diodes, and resistors.

In hybrid circuits, separate component parts are attached to a ceramic substrate and interconnected by means of either a metallization pattern or wire bond. This technology is adaptable to small quantity custom circuits only.

Electrical isolation between the components in monolithic ICs can be achieved by any one of the three isolation techniques dielectric, beam-lead or PN-junction.

Monolithic ICs exhibit good thermal stability because all the components are integrated on the same chip very close to each other.

In thin-film hybrid IC the resistors, capacitors, and interconnections are separately formed on the substrate and a suitable material is evaporated on the substrate to make the connection.

LM380 is a special purpose op-amp, used only for audio power applications.

Op-amp package IC consists of single, dual (two) or Four (quaD. op-amps.

MC1741, CA3741, and SN52741  op-amps have the same specifications and behave the same because the last three digits in each manufacturer designation are 741.

For example, Fairchild’s original µA741 is also manufactured by various other manufacturers under their own designation.

The 741C and 741E are identical to 741 and 741A except that the former have their performance guaranteed over a temperature range 0° to 70° or 75°c.

The 741S is a military-grade op-amp with a higher slew rate (rate of change of output voltage per unit of time) than the 741 op-amps.

The first-generation op-amp has no short circuit protection. The op-amp is susceptible to burnout if the output is accidentally shorted to the ground.

The disadvantage of IC is that, a lack of flexibility in an IC. It is generally not possible to modify the parameters within which an integrated circuit will operate.

Each manufacturer uses a specific code and assigns a specific type number to the ICs produced. That is, each manufacturer uses its own identifying initial followed by an IC type number.

The audio power amplifier is a special purpose op-amp and is used only for the specific application they are designed for.

In hybrid IC first the individual components are made, wired or metallic interconnection is done and finally, they are diffused to form a single circuit.