Type of Integrated Circuit (IC) MCQ [Free PDF] – Objective Question Answer for Type of Integrated Circuit (IC) Quiz

1. What is the best choice of IC package used for experimental purposes?

A. DIP package
B. Metal can package
C. Flatpack
D. Transistor pack

Answer: A

The DIP package is used as it is easy to mount. The mounting does not require bending or soldering of the leads.


2. What is the general information specified in ordering an IC?

A. Temperature range
B. Device type
C. Package type
D. All of the mentioned

Answer: D

Generally, in order for an IC, all three pieces of information must be specified.


3. Find the ordering information for µA741TC.

A. Sprague 741 DIP with Industrial temperature range
B. Intersil 741 DIP with a commercial temperature range
C. Fairchilds 741 DIP with a commercial temperature range
D. Texas instrument 741 metal can with Industrial temperature range

Answer: C

Here “µA” represents the identifying initials used by Fairchild,

T represents the Mini DIP package and C represents the Commercial temperature range.


4. How a Motorola IC with plastic DIP and commercial temperature range is ordered?

A. ICLxxxP -> 0o to 75oc
B. CAxxE -> -55o to +125oc
C. LMxxxxA -> -40o to+85oc
D. MCxxxP -> 0o to 70oc

Answer: D

The ordering format for a typical Motorola IC is,

MCxxxx –> Device type

P –> Package type(Plastic DIP)

0o to 70oc –> Temperature range (Commercial).


5. What does the 1-2-3 numbering system used in National Semiconductor IC denote?

A. Validity in years
B. Temperature range
C. Package type
D. Ordering information

Answer: C

In National linear ICs, a 1-2-3 numbering system is used to represent the temperature range.


6. How does an industrial temperature range device in National Semiconductor IC represented?

A. LM305
B. LM101
C. LM201
D. All of the mentioned

Answer: C

In LM201, the number 2 denotes an industrial temperature range device.


7. Use the device identification method to find the IC of the Fairchild chip manufactured in the year 1980.

A. 80
B. 20
C. 70
D. 60

Answer: B

In the chip, 80 represents the manufactured year

8. Dual-In-Line pack is considered to be suitable for mounting because,

A. Easy to handle
B. Fits mounting hardware
C. Inexpensive
D. All of the mentioned

Answer: C

The DIP pack is easy to handle, fits standard mounting hardware, and is inexpensive when molded on plastic.


9. What is the use of notch and dot in DIP ICs?

A. Determine the pin configuration
B. Designed to represent device type
C. Represent property of IC
D. Find the pin number

Answer: D

A notch and dot as viewed from the top view are used to find the pin terminal. The terminals are numbered counterclockwise.


10. How an eight-pin Dual-In-Line Package is shortly named

A. 8p DIP
B. Maxi DIP
C. Mini DIP

Answer: C

An eight-pin Dual-In-Line Package is called Mini DIP as it is used for devices with a minimum number of inputs and outputs.


11. Which package type is chosen for military purposes?

A. Ceramic DIP
B. Plat pack
C. Metal can pack
D. Plastic DIP

Answer: A

Ceramic DIP can be used for high-temperature and high-performance equipment.


12. A Dual-In-Line Package is usually referred to as

D. All of the mentioned

Answer: A

A Dual-In-Line Package is usually referred to as DIPn. Where, n represent the number of pin terminals in the IC.


13. Which type of DIP IC dissipates more heat?

A. Ceramic DIP
B. Plastic DIP
C. Metal DIP
D. None of the mentioned

Answer: B

Plastic DIPs are cheaper than metal or ceramic DIPs, but are not regarded as satisfactory in extremes of temperature.


14. Choose the type of package used for the Airborne application?

A. DIP package
B. Metal can package
C. Flatpack
D. Transistor pack

Answer: C

The flat pack is more reliable and lighter than a comparable DIP package and therefore is suited for the airborne application.


15. How a choice is made if all three package types are available?

A. Based on cost
B. Based on fabrication
C. Based on Experimentation usage
D. All of the mentioned

Answer: D

When all three packages are available for a specific application, the choice can be made based on the relative cost, ease of fabrication, and breadboarding of the IC.


16. How many temperature grades are available for IC?

A. Two
B. Three
C. Four
D. Five

Answer: B

All ICs manufactured fall into one of the three basic temperature grades. They are military, industrial, and commercial temperature ranges.


17. ICs used for industrial applications will have a temperature range from

A. -55o to +85oc
B. 90o to 155oc
C. 10o to 100oc
D. -20o to +85oc

Answer: D

The industrial temperature range is from -20o to +85oc.


18. Find the types of temperature range used for an IC, which can be used only up to 75oc?

A. Industrial temperature range
B. Commercial temperature range
C. Military temperature range
D. All of the mentioned

Answer: B

Commercial grade IC can be used up to 75oc. It has the worst tolerance among the three types and is the cheapest available IC.


19. Which grade device is selected for superior quality performance?

A. Military-grade IC
B. Industrial grade IC
C. Commercial grade IC
D. None of the mentioned

Answer: A

The military-grade devices are always of superior quality, with tightly controlled parameters, and consequently cost more.


20. In ordering an IC, the device type is represented as

A. Numbers
B. Symbols
C. Alphabets
D. Alphanumeric characters

Answer: D

A device type is a group of alphanumeric characters. For example, 741 IC is represented as µA741, LM741, and MC1741.


21. How many gates per chip are used in first-generation Integrated Circuits?

A. 3-30
B. 30-300
C. 300-3000
D. More than 3000

Answer: A

The first generation ICs belongs to small-scale integration, which consists of 3-30 gates per chip (approximately).


22. Find the chip area for a Medium Scale Integration IC?

A. 8 mm3
B. 4 mm2
C. 64 mm3
D. 16 mm2

Answer: D

The approximate length and breadth of Medium Scale Integration would be 4 mm. Therefore, its area is given as = length × breadth = 4mm × 4mm = 16mm2.


23. The number of transistors used in Very Large Scale Integration is

A. 107 transistors/chip
B. 106 – 107 transistors/chip
C. 203 – 105 transistors/chip
D. 102 – 203 transistors/chip

Answer: C

Very Large Scale Integration (VLSI) ICs are fabricated using more than 3000 gates/chip, which is equivalent to 20,000 – 1,00,00,00 transistors/chip.


24. What type of integration is chosen to fabricate Integrated Circuits like Counters, multiplexers, and Adders?

A. Small Scale Integration (SSI)
B. Medium Scale Integration (MSI)
C. Large Scale Integration (LSI)
D. Very Large Scale Integration (VLSI)

Answer: B

Fabrication of ICs like counters, multiplexers, and Adders requires 30-300 gates per chip. Therefore, Medium Scale Integration is best suitable.


25. Determine the chip area for Large Scale Integration ICs.

A. 1,00,000 mil2
B. 10,000 mil2
C. 1,60,000 mil2
D. 16,000 mil2

Answer: C

The chip area for a Large Scale Integration IC is 1 cm2.

=> Area of LSI = 10mm × 10mm = 1cm × 1 cm = 1cm2.

=> 1,60,000mil2 (1cm=400mil).


26. Ultra Large Scale Integration is used in the fabrication of

A. 8-bit microprocessors, RAM, ROM
B. 16 and 32- bit microprocessors
C. Special processors and Smart sensors
D. All of the mentioned

Answer: C

Ultra Large Scale Integration has nearly 106 – 107 transistors/chip. Hence, it is possible to fabricate smart sensors and a special processor.


27. The concept of Integrated circuits was introduced at the beginning of 1960 by

A. Texas instrument and Fairchild Semiconductor
B. Bell telephone laboratories and Fair child Semiconductor
C. Fairchild Semiconductor
D. Texas instrument and Bell telephone Laboratories

Answer: A

The concept of Integrated circuits was introduced by Texas instrument and Fairchild Semiconductor, whereas Bell telephone laboratories developed the concept of transistors.


28. Which process is used to produce small circuits of micron range on silicon wafer?

A. Photo etching
B. Coordinatograph
C. Photolithography
D. Ion implantation

Answer: C

It is possible to fabricate as many as 10,000 transistors on a 1cmX1cm chip, using a photolithography process.


29. Mention the technique used in the photolithography process

A. X-ray lithographic technique
B. Ultraviolet lithographic technique
C. Electron beam lithographic technique
D. All of the mentioned

Answer: D

All these techniques are used to produce device dimensions as small as 2µm or even down to the sub-micron range (<1µm).


30. Find the basic chemical reaction used for Epitaxial growth?

A. Sic4 + 4H ↔ Si + 4Hcl

B. Sic2 + H2 ↔ Si + 2Hcl

C. Sic4 + H2 ↔ Si + 4Hcl

D. 2Sic2 + 2H2 ↔ 4Si + Hcl

Answer: C

The basic chemical reaction used for epitaxial growth of pure silicon is the hydrogen reduction of silicon tetrachloride i.e Sic4 + H2 ↔ Si + 4Hcl

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