VLSI layout floor plan MCQ Quiz – Objective Question with Answer for VLSI layout floor plan

1. A 4-bit processor has two buses which are

A. unidirectional
B. bidirectional
C. one unidirectional and one bidirectional
D. more than two buses

Answer: C

A 4-bit processor has two buses one is bidirectional to carry operand and output to shifter and register array and another bus is unidirectional to carry input.

 

2. The IN and OUT bus lines relative positions are interchanged to

A. match height
B. match length
C. match width
D. match thickness

Answer: A

The IN and OUT bus line’s relative positions are interchanged to make the cell stretchable and to match the height of the block and spacings.

 

3. The IN and OUT bus lines should be in

A. metal
B. polysilicon
C. diffusion
D. silicon

Answer: A

The IN and OUT bus lines should be in metal rather than diffusion or polysilicon to mate with the bus structures of other blocks.

 

4. Extensions are

A. vertical
B. horizontal
C. diagonal
D. haphazard

Answer: B

Extensions are horizontal or parallel to the stratified unit and rifts are described as extension zones.

 

5. Rifts and extensions should be placed in

A. The minimum amount of geometry
B. The maximum amount of geometry
C. in slopes
D. anywhere in the layout

Answer: A

Rifts and extensions should be placed where they cut a minimum amount of simple geometry, one in polysilicon and one in diffusion.

 

6. Rifts are used for smooth flow through buses.

A. true
B. false

Answer: A

Rifts are used for smooth flow through buses as suggested and hence one is used in polysilicon and the other in diffusion.

 

7. Input and output pads are made up of

A. polysilicon
B. metal
C. silicon
D. carbon

Answer: B

Input and output pads are made up of metal and it used to connect chips from one circuitry to another.

 

8. Bonding pads are placed

A. in the chip
B. exactly at the center of the chip
C. edge of the chip
D. above the chip

Answer: C

Bonding pads are positioned near the edge of the chips although there will be a Vdd bus between bonding pads and the chip boundary.

 

9. Which pad contains Schmitt trigger circuitry?

A. Vdd pads
B. Vss pads
C. input pads
D. output pads

Answer: C

The input pad contains overvoltage protection features and also contains inverting circuitry or Schmitt trigger circuitry.

 

10. Which occupies a lesser area?

A. Vdd pads
B. Vss pads
C. input pads
D. output pads

Answer: D

Output pads provide a large current for off-wiring and also inputs to other devices. But these pads use minimum space.

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