1. How many gates per chip are used in first-generation Integrated Circuits?
A. 3-30
B. 30-300
C. 300-3000
D. More than 3000
2. Find the chip area for a Medium Scale Integration IC?
A. 8 mm3
B. 4 mm2
C. 64 mm3
D. 16 mm2
3. The number of transistors used in Very Large Scale Integration is
A. 107 transistors/chip
B. 106 – 107 transistors/chip
C. 203 – 105 transistors/chip
D. 102 – 203 transistors/chip
4. What type of integration is chosen to fabricate Integrated Circuits like Counters, multiplexers, and Adders?
A. Small Scale Integration (SSI)
B. Medium Scale Integration (MSI)
C. Large Scale Integration (LSI)
D. Very Large Scale Integration (VLSI)
5. Determine the chip area for Large Scale Integration ICs.
A. 1,00,000 mil2
B. 10,000 mil2
C. 1,60,000 mil2
D. 16,000 mil2
6. Ultra Large Scale Integration is used in the fabrication of
A. 8-bit microprocessors, RAM, ROM
B. 16 and 32- bit microprocessors
C. Special processors and Smart sensors
D. All of the mentioned
7. The concept of Integrated circuits was introduced at the beginning of 1960 by
A. Texas instrument and Fairchild Semiconductor
B. Bell telephone laboratories and Fair child Semiconductor
C. Fairchild Semiconductor
D. Texas instrument and Bell telephone Laboratories
8. Which process is used to produce small circuits of micron range on silicon wafer?
A. Photo etching
B. Coordinatograph
C. Photolithography
D. Ion implantation
9. Mention the technique used in the photolithography process
A. X-ray lithographic technique
B. Ultraviolet lithographic technique
C. Electron beam lithographic technique
D. All of the mentioned
10. Find the basic chemical reaction used for Epitaxial growth?
A. Sic4 + 4H ↔ Si + 4Hcl
B. Sic2 + H2 ↔ Si + 2Hcl
C. Sic4 + H2 ↔ Si + 4Hcl
D. 2Sic2 + 2H2 ↔ 4Si + Hcl
11. Which component is added to the p-type material in order to get the impurity concentration in epitaxial films?
A. Bi-borane (B2H2)
B. Phosphine (PH3)
C. Boron chloride (BCl3)
D. Phosphorous pentoxide (P2O5)
12. Where are the silicon wafers placed in the reaction chamber for the epitaxial growth process?
A. Cup
B. Boats
C. Ingots
D. Crucible
13. Which of the following is used to obtain silicon crystal structure while fabricating Integrating Circuits?
A. Oxidation
B. Epitaxial growth
C. Photolithography
D. Silicon wafer preparations
14. Why oxidation process is required?
A. To protect against contamination
B. To use it for fabrication of various components
C. To prevent diffusion of impurities
D. All of the mentioned
15. Mention the chemical reaction for oxidation process
A. Si + 2H2O –> SiO2 + 2H2
B. Si + O2 –> SiO2
C. 2Si + 2H2O –> 2SiO2 + 2H2
D. 2Si + 2H2O + 2O2 –> 2SiO2 + 2H2 + O2
16. At what temperature should the oxidation process be carried out to get an oxide film of thickness 0.02 to 2µm?
A. 0-105oc
B. 950-1115oc
C. 200-850oc
D. 350-900oc
17. Oxidation process in silicon planar technology is also called as
A. Photooxidation
B. Silicon oxidation
C. Vapour oxidation
D. Thermal oxidation
18. In the Crzochralski crystal growth process, the materials are heated up to
A. 950oc
B. 1000 oc
C. 1420oc
D. 1200oc
19. How to obtain silicon ingots of 10-15cm diameter?
A. By crystal pulling process
B. By crystal melting process
C. By crystal growing process
D. All of the mentioned
20. If the thickness of the wafer after all polishing steps in silicon wafer preparation is 23-40 mils. Find its raw cut slice thickness?
A. 16-32 mils
B. 23-40 mils
C. 8-12 mils
D. None of the mentioned
21. The process involved in photolithography is
A. Making of a photographic mask only
B. Photo etching
C. Both photo etching and the making of the photographic mask
D. None of the mentioned
22. How will be the initial artwork done for a normal IC?
A. Smaller than the final dimension of chip
B. Same as that of final dimension of chip
C. Larger than the final dimension of chip
D. None of the mentioned
23. Find the area of artwork done for a monolithic chip of area 30mil × 30mil.
A. 16 cm × 16 cm
B. 60 cm × 60 cm
C. 12 cm × 12 cm
D. 36 cm × 36 cm
24. Mylar coated with a sheet of red photographic Mylar is used for artwork (layout) because,
A. It is used to get a colorful layout
B. It can be easily peeled off from the layout
C. It is recommended color for layouts
D. It is used for highlighting layout